SE Bonding System
A sixth generation direct bonding system that is a self-etching, light-cured & filled two- component adhesive for enamel and dentin.
Applications:
- For use in all light-accessible bonding procedures
- For use in immediate dentin sealing prior to temporization
Kit Configuration: (2) 5ml Bottles with (25) Applicator Brushes and (25) Application Wells
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- Two-part bond system
- Eliminates separate etching step
- Simple and easy-to-use
- Cures with all lights
- Versatility allows clinician to use cutting light of choice
- 7.5% nano fillers
- Increased bond strength
- Seals tubules, which minimizes post-op sensitivity, microleakage and microbial invasion
- Consistently high bond strengths
- 66 MPa bond strength to Dentin
- 35 MPa bond strength to Enamel
